燙(tang)金基(ji)本工藝是在(zai)壓力(li)(li)狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)(wu)壓住的(de)狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)使其上(shang)熱(re)熔(rong)性的(de)有(you)機硅樹(shu)脂(zhi)(zhi)層(ceng)和膠(jiao)(jiao)牯劑熔(rong)化(hua)(hua)，此時受熱(re)熔(rong)化(hua)(hua)的(de)有(you)機硅樹(shu)脂(zhi)(zhi)粘(zhan)(zhan)性變(bian)小，而特種(zhong)熱(re)敏膠(jiao)(jiao)粘(zhan)(zhan)劑受熱(re)熔(rong)化(hua)(hua)后粘(zhan)(zhan)性增(zeng)加，使得鋁(lv)(lv)層(ceng)與(yu)電(dian)化(hua)(hua)鋁(lv)(lv)基(ji)膜剝(bo)離的(de)同時轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)(wu)上(shang)。隨著壓力(li)(li)的(de)卸除，膠(jiao)(jiao)粘(zhan)(zhan)劑迅(xun)速冷卻(que)固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地附著在(zai)承(cheng)印(yin)(yin)物(wu)(wu)上(shang)，完成一個燙(tang)印(yin)(yin)過程。