燙(tang)金基本工藝是(shi)在壓(ya)(ya)力(li)(li)狀態，即(ji)電(dian)(dian)化(hua)鋁(lv)被(bei)燙(tang)印(yin)版、承印(yin)物壓(ya)(ya)住的狀態下，電(dian)(dian)化(hua)鋁(lv)受熱(re)(re)使(shi)(shi)其上(shang)熱(re)(re)熔(rong)(rong)(rong)性的有機硅樹脂(zhi)層和膠牯(gu)劑(ji)熔(rong)(rong)(rong)化(hua)，此時受熱(re)(re)熔(rong)(rong)(rong)化(hua)的有機硅樹脂(zhi)粘(zhan)性變小，而特種熱(re)(re)敏(min)膠粘(zhan)劑(ji)受熱(re)(re)熔(rong)(rong)(rong)化(hua)后粘(zhan)性增加，使(shi)(shi)得鋁(lv)層與電(dian)(dian)化(hua)鋁(lv)基膜(mo)剝(bo)離的同時轉印(yin)到了承印(yin)物上(shang)。隨著壓(ya)(ya)力(li)(li)的卸除，膠粘(zhan)劑(ji)迅速(su)冷卻固化(hua)，鋁(lv)層牢(lao)固地附著在承印(yin)物上(shang)，完成一個燙(tang)印(yin)過程。